Open Access
Table 1
Thermal properties of polymer [23] and mold plates [24].
| Temperature (°C) | Density (kg m−3) | Heat capacity (J kg−1 K−1) | Thermal conductivity (W m−1 K−1) | |
|---|---|---|---|---|
| Mold material AMPCO 940 | 8710 | 380 | 208 | |
| Polymer PC typed LEXAN Resin 915R | 120 | 1190 | 1612 | 0.275 |
| 130 | 1693 | 0.278 | ||
| 140 | 1823 | 0.282 | ||
| 150 | 1885 | 0.286 | ||
| 160 | 1909 | 0.298 | ||
| 170 | 1929 | 0.31 | ||
| 180 | 1947 | 0.322 | ||
| 200 | 1976 | 0.227 | ||
| 220 | 2003 | 0.235 | ||
| 240 | 2020 | 0.242 | ||
| 260 | 2030 | 0.248 |
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