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Cited article:

Lifetime prediction of a viscoplastic lead-free solder in power electronics modules under passive temperature cycling

Z. Sun, L. Benabou, P. Dahoo

Mechanics & Industry, 17 3 (2016) 306

Published online: 2016-02-18

DOI: https://doi.org/10.1051/meca/2015080

This article has been cited by the following article(s):

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https://doi.org/10.1007/s00542-020-04884-9

Modeling and experimentation of creep-fatigue and failure of low-profile quad flat package under thermal cycle

Ayda Halouani, Abel Cherouat, Mariem Miladi Chaabane and Mohamed Haddar
Proceedings of the Institution of Mechanical Engineers, Part C: Journal of Mechanical Engineering Science 234 (21) 4277 (2020)
https://doi.org/10.1177/0954406220920680